CHANDLER, Arizona, Oct. 14, 2014 /PRNewswire/ — Rogers Corporation’s (NYSE: ROG) Advanced Circuit Materials Division, a global leader in Microwave Printed Circuit Board (PCB) Materials, recently introduced rolled copper cladding options with its RO3003™, RO3035™ and RO3203™ low dielectric constant laminate materials. Smooth rolled copper, paired with the very low dielectric loss of the RO3000® PTFE-ceramic resin system, results in high frequency circuit materials with best-in-class insertion loss. These materials are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul communications systems. While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant laminates are now available with rolled copper foils from 1/2 ounce up to 0.040" thick rolled copper plate, further reducing insertion loss.
About RO3000 Laminate Materials
RO3000 high frequency circuit materials are ceramic-filled PTFE composites, available in a wide range of dielectric constants, intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices. RO3000 series laminates are available without woven fiberglass reinforcement providing circuit materials with unique, electrically isotropic properties compared to competitive material offerings.
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global technology leader in specialty materials and components that enable high performance and reliability of consumer electronics, power electronics, mass transit, clean technology, and telecommunications infrastructure. With more than 180 years of materials science and process engineering knowledge, Rogers provides product designers with solutions to their most demanding challenges. Rogers’ products include advanced circuit materials for wireless infrastructure, power amplifiers, radar systems, high speed digital; power electronics for high-voltage rail traction, hybrid-electric vehicles, wind and solar power conversion; and high performance foams for sealing and energy management in smart phones, aircraft and rail interiors, automobiles and apparel; and other advanced materials for diverse markets including defense and consumer products. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, Belgium, China, Germany, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.
Website Address: http://www.rogerscorp.com/acm